Automotive Infotainment Main Unit PCB

This project involves the design and manufacturing of a high-complexity printed circuit board assembly (PCB) for an automotive infotainment system. This PCB integrates multimedia processing, navigation, connectivity, and vehicle interface functions into a single, ruggedized platform designed for the demanding automotive environment.
Key PCB Specifications:
Base Material: Automotive-grade FR4 with enhanced thermal resistance and CAF (Conductive Anodic Filament) resistance
Layer Stackup: 8-layer HDI construction with 1+N+1 structure for fine-pitch BGA fanout and signal integrity
Copper Weight: 1 Oz all layers with controlled impedance (50Ω, 90Ω, 100Ω) for high-speed interfaces
Board Thickness: 1.6 mm, with selective stiffeners for large connector mounting
Surface Finish: ENIG with 3-5μ" gold for connector durability and soldering reliability
EMI Control: Embedded shielding cans and optimized grounding for EMI compliance with CISPR 25 Class 5
Quality Assurance: 100% functional testing including RF performance validation and accelerated life testing

Functional Role:
This PCB delivers a premium in-vehicle entertainment and connectivity experience:
Application Processing: Quad-core ARM Cortex-A55 processor with 4GB LPDDR4 for smooth graphics and multitasking
Audio Processing: 8-channel audio DSP with 24-bit DAC for premium sound quality and active noise cancellation
Video Handling: Dual display support (center stack and rear-seat) with 1080p video decoding
Connectivity: Integrated WiFi 6, Bluetooth 5.2, and 4G LTE modem for seamless connectivity
Vehicle Interface: CAN FD and LIN interfaces for vehicle data integration and control
Navigation: GPS/GLONASS/Galileo receiver with dead reckoning for reliable positioning