impedance control printed circuit board
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Machinable Glass Ceramic PCB for Prototype and Low Volume Production
Product Overview: Ceramic PCB from PCBGATE is built for high heat and high power applications.Transparent polycrystalline alumina ceramic PCB, transmittance >80% at 5002000nm (1mm thickness). Key Selling Points: Ceramic PCB from PCBGATE is built for high heat and high power applications. It offers excellent heat dissipation and electrical insulation, making it ideal for LED lighting, automotive, and power modules. Instant PCB(1-38 layers) --PCBgate PCBgate is a
High Fracture Toughness Ceramic PCB with Zirconia Reinforcement
Product Overview: Ceramic PCB from PCBGATE is built for high heat and high power applications.Transparent polycrystalline alumina ceramic PCB, transmittance >80% at 5002000nm (1mm thickness). Key Selling Points: Ceramic PCB from PCBGATE is built for high heat and high power applications. It offers excellent heat dissipation and electrical insulation, making it ideal for LED lighting, automotive, and power modules. Instant PCB(1-38 layers) --PCBgate PCBgate is a
Ultra‑Low Thermal Expansion Ceramic PCB (CTE ~2 ppm/°C)
Product Overview: Ceramic PCB from PCBGATE is built for high heat and high power applications.Cordierite or lithium aluminosilicate ceramic PCB, CTE ~2 ppm/C (RT300C). Matches Si and GaAs. Ideal for large area die attachment, focal plane arrays, and precision optical mounts. Key Selling Points: Ceramic PCB from PCBGATE is built for high heat and high power applications. It offers excellent heat dissipation and electrical insulation, making it ideal for LED lighting,
High Dielectric Constant Ceramic PCB (Dk > 50) for Antenna Miniaturization
Product Overview: Ceramic PCB from PCBGATE is built for high heat and high power applications.Cordierite or lithium aluminosilicate ceramic PCB,TiObased or barium titanate ceramic PCB, Dk >50 at 1MHz1GHz, loss tangent
Low Dielectric Constant Ceramic PCB (Dk < 5) for High Speed Digital
Product Overview: Ceramic PCB from PCBGATE is built for high heat and high power applications.Fused silica or porous alumina ceramic PCB, Dk 3.54.5 at 10GHz, Df
Metal Core Ceramic PCB (MCC) for Ultra High Thermal Spreading
Product Overview: Ceramic PCB from PCBGATE is built for high heat and high power applications. Metal Core Ceramic PCB (MCC) for Ultra High Thermal Spreading Key Selling Points: Ceramic PCB from PCBGATE is built for high heat and high power applications. It offers excellent heat dissipation and electrical insulation, making it ideal for LED lighting, automotive, and power modules. Instant PCB(1-38 layers) --PCBgate PCBgate is a professional PCB manufacturer providing high
Co‑fired Ceramic PCB with Integrated Cooling Channels
Product Overview: Ceramic PCB from PCBGATE is built for high heat and high power applications. LTCC or HTCC ceramic PCB with internal microchannels (200500m diameter). Liquid coolant (water/glycol) can be circulated. Heat flux removal >1000 W/cm possible. Key Selling Points: Ceramic PCB from PCBGATE is built for high heat and high power applications. It offers excellent heat dissipation and electrical insulation, making it ideal for LED lighting, automotive, and power
Round Integrated LED Aluminum PCB Module (MCPCB) with High Thermal Conductivity and Built-In Driver for Uniform Light Layout
Integrated Driver Design :Combines constant current driver, protection circuits, and LED pads on one board, eliminating the need for a separate driver to simplify assembly and reduce costs High Thermal Dissipation Performance :Premium aluminum substrate delivers superior heat dissipation, outperforming standard FR-4, to cool LEDs and driver components, slowing light decay and extending lifespan Round Uniform Light Layout :Evenly arranged LEDs provide consistent light
6-Layer Automotive HDI PCB: Advanced ADAS & Sensor Solution
6-Layer Automotive HDI PCB: Advanced ADAS & Sensor Solution Product Overview: Our 6-layer HDI PCBs are engineered for high-performance automotive electronics, including ADAS modules, camera systems, and smart connectivity gateways. By utilizing a sophisticated 6-layer stack-up with precision micro-via technology, we enable high-speed data processing and superior signal isolation in a space-saving design. These boards are built with specialized materials to withstand harsh